# MODEL ANALYZING FOR REUSING GOLD WIRE CAPILLARY IN THE GOLD WIRE BONDING PROCESS

## Keywords:

reusing capillary, gold wire bonding, bond shear, design of experiment

## Abstract

Manufacturing process improvement is necessary for manufacturers to gain business advantages. Re-using or increasing the useful lives of machine parts is considered to be a process of performance improvement. To re-use parts, the manufacturers must know the effects of the factors related to workpieces' qualities to prevent defects. This research study aims at presenting the results of analysing the effects of the factors and mathematical models for bond shear strength when reusing gold wire bonding capillary in the gold wire bonding process of integrated circuit (IC) products using design experiment. The operation factors in the reference experiment, including bond force, bond time, USG current, EFO current and EFO gap, are investigated. The Fractional Factorial Design was used to determine five factors that affect the bond shear strength. The analysis of the results show that the bond force is a significant factor where increasing bond force factors leads to increasing bond shear strength. In the end, a Regression model of bond shear strength is obtained to show the result between the bond shear strength and effect of factors.

ABSTRAK: Proses pembaharuan pengilangan adalah penting untuk para pengilang bagi memperoleh keuntungan bisnes. Guna-semula atau menambah jangka hayat pada bahagian-bahagian tertentu pada mesin adalah dianggar sebahagian proses penambahbaikan prestasi mesin. Bagi mengguna semula bahagian-bahagian ini, pengilang mesti mengetahui akibat sesuatu faktor berkaitan kualiti bahan bagi mengelak kecacatan. Kajian ini bertujuan menyampaikan dapatan kajian melalui kesan faktor dan model matematik pada kekuatan ricihan ikatan apabila mengguna semula wayar emas melalui proses kapilari ikatan wayar emas pada produk litar bersepadu melalui rekaan eksperimen. Faktor operasi melalui rujukan eksperimen dari daya ikatan, masa ikatan, arus USG, arus EFO dan jarak EFO dikaji. Rekaan Faktorial Pecahan digunakan bagi mendapatkan lima faktor yang mempengaruhi kekuatan ricihan ikatan. Dapatan kajian menunjukkan daya ikatan merupakan faktor penting di mana, pertambahan faktor daya ikatan menguatkan ricihan ikatan. Akhirnya, model Regression kekuatan ricihan ikatan diperoleh bagi menjelaskan dapatan kajian antara kekuatan ricihan ikatan dan kesan faktor.

## References

Krajcsák Z. (2019) Implementing open innovation using quality management systems: the role of organizational commitment and customer loyalty. J. of Open Innovation: Technology, Market, and Complexity, 5(4): 90. https://doi.org/10.3390/joitmc5040090 DOI: https://doi.org/10.3390/joitmc5040090

Prabowo R, Singgih ML, Karningsih PD, Widodo E. (2020) New product development from inactive problem perspective in Indonesian SMEs to open innovation. Journal of Open Innovation: Technology, Market, and Complexity., 6(1): 20. https://doi.org/10.3390/joitmc6010020 DOI: https://doi.org/10.3390/joitmc6010020

Phimpha C, Sindhuchao S. (2020) The process of reusing machine part in gold wire bonding process of IC packaging product. The International Academic Conference on Engineering, Technology and Innovations. Bali. Indonesia, pp.13-14.

Hung YH. (2007) Optimal process parameters design for a wire bonding of ultra?thin CSP package based on hybrid methods of artificial intelligence. Microelectronics International, 24(3): 3-10. DOI: https://doi.org/10.1108/13565360710779136

Wang, Sun R. (2009) The quality test of wire bonding. Modern Applied Science, 3(12): 50-56. DOI: https://doi.org/10.5539/mas.v3n12p50

Bonding W. (2008) The great debate: Copper vs. gold ball bonding. Advanced Packaging, 17(7): 20.

Kim BC, Ha SJ, Yang JK, Lee IC, Kang DS, Han BS, Han YJ. (2017) Process capability optimization of ball bonding using response surface analysis in light emitting diode (LED) wire bonding. Journal of the Korea Academia-Industrial Cooperation Society, 18(4): 175-182.

Zhong ZW. (2009) Fine and ultra?fine pitch wire bonding: challenges and solutions. Microelectronics International, 22(2): 10-18. DOI: https://doi.org/10.1108/13565360910960187

Sciammarella FM, Salehi Najafabadi B. (2018) Processing parameter DOE for 316L using directed energy deposition. J. of Manufacturing and Materials Processing, 2(3): 61. DOI: https://doi.org/10.3390/jmmp2030061

Wu YX, Long ZL, Lei HAN, Zhong J. (2006) Temperature effect in thermosonic wire bonding. Transactions of Nonferrous Metals Society of China, 16(30): 618-622. DOI: https://doi.org/10.1016/S1003-6326(06)60109-X

Satianrangsarith W, Tirakanogsathit M. (2012) Design of experiments approach for improving wire bonding quality. International Journal of Innovation, Management and Technology, 3(4): 327-331. DOI: https://doi.org/10.7763/IJIMT.2012.V3.248

Lu D, Wong CP. (2018) Materials for advanced packaging. Springer International Publishing, Switzerland.

Antony J. (2014) Design of experiments for engineers and scientists. Elsevier.

Montgomory DC, Runger GC. (2011) Applied Statistics and Probability for Engineering. John Wiley & Son Inc, U.S.A.

Gong Y, Song J, Lin S, Yang J, He Y, Tan G. (2020) Design Optimization of Rubber-Basalt Fiber-Modified Concrete Mix Ratios Based on a Response Surface Method. Applied Sciences, 10(19): 6753. DOI: https://doi.org/10.3390/app10196753

Mayer RM, Montgomery DC. (2011) Response surface methodology: Process and product Optimization using design experiment. John Wiley & Sons Inc, U.S.A.

Sabry I, El-Kassas AM, Mourad AHI, Thekkuden DT, Abu Qudeiri J. (2019) Friction stir welding of T-Joints: Experimental and statistical analysis. J. of Manufacturing and Materials Processing, 3(2): 38. DOI: https://doi.org/10.3390/jmmp3020038

Martin J, De Adana DDR, Asuero AG. (2017) Fitting models to data: residual analysis, a primer. Chapter 7. DOI: https://doi.org/10.5772/68049

Mongomery DC. (2009) Design and analysis of experiment. John Wiley & Sons Ltd U.S.A.

Mongomery DC. (2009) Statistical Quality Control a Modern introduction. John Wiley & Sons Ltd U.S.A.

2021-07-04

## How to Cite

Phimpha, C., & Sindhuchao, S. (2021). MODEL ANALYZING FOR REUSING GOLD WIRE CAPILLARY IN THE GOLD WIRE BONDING PROCESS . IIUM Engineering Journal, 22(2), 306–315. https://doi.org/10.31436/iiumej.v22i2.1715

## Section

Materials and Manufacturing Engineering