PHIMPHA, C.; SINDHUCHAO, S. MODEL ANALYZING FOR REUSING GOLD WIRE CAPILLARY IN THE GOLD WIRE BONDING PROCESS . IIUM Engineering Journal, [S. l.], v. 22, n. 2, p. 306–315, 2021. DOI: 10.31436/iiumej.v22i2.1715. Disponível em: https://journals.iium.edu.my/ejournal/index.php/iiumej/article/view/1715. Acesso em: 3 dec. 2021.